In 2023, the average thickness of multi-Si wafers will be 170 μm
so it is predicted that the thickness will remain unchanged at 170 μm after 2024, but it is not ruled out that there is still the possibility of thinning in the later period
The average thickness of p-type mono wafers is around 150μm, down 5μm from 2022
average thickness of n-type wafers for TOPCon cells and HJT cells is 125μm, and the thickness of n-type wafers for TOPCon cells is about 120μm, a decrease of 15μm and 5μm respectively compared with 2022
