Check out the images to get a nice visualization of solar cells being linked together (sorry I didn’t include, fixing website stuff still!). You’ve got to look closely at the left image (shingle cells) to really see the connections. Incremental advances.
SOURCE: More challenging solar cell processing due to thinner wafers and emerging new cell designs has illuminated the need for an evolution in electrical interconnect materials. This in combination with the cost pressures facing solar technology manufacturers, as well as the requirement for increased module power output, has driven the development of Henkel’s latest line of next-generation electrically conductive adhesives. The formulations also offer exceptional processing and performance characteristics, including compatibility with wafer thicknesses of less than 160 µm; fast printing and dispensing capability at speeds of greater than 200 mm per second; and full curing in less than 20 seconds at low temperatures between 110°C and 150°C, allowing maximum UPH and improving in-line inspection and yields. LOCTITE ABLESTIK ICP 8000 series materials are compatible with all cell architectures including PERC, n-PERT, HJT and third-generation photovoltaic cells, and are available in all regions globally. Reliable tabbing with wafer thicknesses below 160 μm and is designed for both Ag, Sn and SnPb ribbon. It has 1.2 N/mm+ peel strength on all common ribbon types and 200+ mm/sec. print speeds and < 30 sec. cure at 120°C, < 10 sec. cure at 150°C, making the 8000 series compatibility with heterojunction and third-generation cell architectures. For shingled solar modules the 800 series offers 200+ mm/sec. dispense and print speeds and < 30 sec. cure at 120°C, < 10 sec. cure at 150°C, which can be optimized on equipment vendor’s tools.